
Full Paper Submission Deadline: April 15,2026
Acceptance Notification: April 20, 2026
Early Registration Deadline: May 25, 2026
Conference Dates: June 9-12, 2026

IEEE EDSSC 2026 is the 17th in a series of very successful conferences initiatedby IEEE ED/SSC Beijing Section Hongkong Chapter. EDSSC 2026 continues the EDSSC tradition as a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the broad areas of electron devices and solid-state circuits and systems. The technical program includes invited talks by famous scientists and contributed papers. All accepted papers will be invitedto submit to the lEEE Xplore database which will be indexed by EI Compendex.
At the forefront of the global STI mega-trend, China has been creating an increasingly open STI environment, increasing the depth and breadth of academic collaboration, and building a community of innovation that benefits all. These efforts make a new contribution to globalization and the creation of a common community for the future.
The EDSSC conference aims to gather professors, researchers, scholars and industrial pioneers all over the world. EDSSC is the premier forum for the presentation and exchange of past experiences and new advances and research results in the field of theoretical and industrial experience. The conference welcomes contributions which promote the exchange of ideas and rational discourse between educators and researchers all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to EDSSC 2026.
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本次会议由广州科奥信息技术股份有限公司代收会议作者及相关赞助展商的会议注册费、赞助费和出具发票, 会议期间食宿及交通费用自理。
账号信息如下:
开户行:中国工商银行股份有限公司广州育蕾街支行 (银行行号:102581002280 )
户 名:广州科奥信息技术股份有限公司
账 号:3602879819100299208