edssc logo

IEEE International Conference on

Electron Devices and Solid-State Circuits

June 6-8, 2018

Marriott Hotel Golden Bay,

Shenzhen, P. R. China

Welcome to EDSSC

The EDSSC, first initiated by IEEE ED/SSC Hong Kong Joint Chapter, has been a series of very successful conferences. It provides a stimulating and friendly environment for experts and academics to disseminate research and development results in the broad field of Electron Devices and Solid-State Circuits. EDSSC 2018 continues the EDSSC tradition as a multidisciplinary forum for the exchange of ideas, research results, and industry experience. The technical program includes invited talks by famous scientists and contributed papers. All accepted papers will be invited to submit to the IEEE Xplore database.

Recent News

2018-05-15

Tentative program is now ready from the Program section

2018-03-14

Paper submission Deadline has been postponed to March 30 (Friday)

2018-03-05

Paper submission system ready. Authors can start submitting their papers to the conference

2018-01-15

Conference Website Launched.
Authors are invited to submit 2-page extended abstracts to the conference

Important Dates:
Submission Deadline: March 16, 2018
Acceptance Notification: April 20, 2018